96000
m²
Industrialized factory
6
million square meters
Monthly output up to
Welcome to Aimi New Materials !
Aimi New Materials specializes in the production of UV viscosity reducing PO-based film, used in wafer grinding tape, wafer cutting tape, chip package cutting tape, semiconductor discrete devices and LED lamp bead cutting tape, filter cutting tape, glass substrate TGV/TSV packaging base film, PCB board, soft & hard bonding board for hot pressing process blocking film, PO replacement PVC substrate and other popular high-tech fields. Aimi New Materials is committed to providing more efficient, reliable and environmentally friendly solutions for the semiconductor manufacturing industry.
Aimi New Materials specializes in the production of UV viscosity reducing PO-based film, used in wafer grinding tape, wafer cutting tape, chip package cutting tape, semiconductor discrete devices and LED lamp bead cutting tape, filter cutting tape, glass substrate TGV/TSV packaging base film, PCB board, soft & hard bonding board for hot pressing process blocking film, PO replacement PVC substrate and other popular high-tech fields. Aimi New Materials is committed to providing more efficient, reliable and environmentally friendly solutions for the semiconductor manufacturing industry.
Learn MoreIndustrialized factory
Monthly output up to
The semiconductor industry is constantly evolving, demanding highly precise and reliable technologies. In this field, UV tapes play a significant role by offering a wide range of applications and adva..
08
2025-05In a variety of industrial and commercial applications, high-temperature tape has become an indispensable tool. These applications cover a wide range of fields, from automotive manufacturing to aerosp..
08
2025-05Avoid the impact of silicon materials on certain applications: In some special applications, silicon materials may not be suitable or have certain adverse effects. For instance, in the manufacturing p..
08
2025-05Substrate Fixation: The tape is utilized to secure semiconductor chips onto the packaging base or substrate, ensuring they remain in the correct position during the encapsulation process. This is cruc..
08
2025-05
2025-05-16
2025-05-08