Semiconductor separation device cutting tape base film

Product Advantages

Excellent film spreading performance Resistance to tensile deformation, reduce cutting stress conduction.
High temperature resistance The working temperature is -40℃~180℃, so that the rubber layer is not carbonized when cutting.
Low thermal expansion Thermal shrinkage ≤0.3% at 150℃ for 30 minutes, reducing thermal stress cracks and ensuring cutting accuracy.
High light transmittance Easy to observe and detect.
  • product details

Product application:Low cutting loss, excellent film spreading performance. Suitable for LED lamp beads, sensors and passive components cutting tape.

Quality assurance:This product is to be used within 6 months from the date of delivery in standard packaging. Please evaluate the product according to your intended use and judge the performance reliability of the product according to your criteria.

Storage specification:The general storage temperature is 5~35℃, the relative humidity is 40%~70%, please avoid direct sunlight, and put them in well-ventilated place.

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