| High strength bracing | The base film has excellent tensile strength and tear strength, and superior buffering performance. |
| Chemically stable | Good tolerance to all kinds of chemical reagents used in the grinding process, such as grinding fluids, cleaning agents, etc. |
| High flatness | The thickness tolerance of the base film is small, which can ensure the flatness and thickness consistency of the wafer during the grinding process. |
| ductility | Excellent horizontal and longitudinal ductility, which can adapt to small deformation during grinding. |
Product application:Excellent cushioning performance, no precipitation and excellent appearance flatness. Suitable for wafer and glass thinning tape.
Storage specification:The general storage temperature is 5~35℃, the relative humidity is 40%~70%, please avoid direct sunlight, and put them in well-ventilated place.

