Wafer grinding tape base film

Product Advantages

High strength bracing The base film has excellent tensile strength and tear strength, and superior buffering performance.
Chemically stable Good tolerance to all kinds of chemical reagents used in the grinding process, such as grinding fluids, cleaning agents, etc.
High flatness The thickness tolerance of the base film is small, which can ensure the flatness and thickness consistency of the wafer during the grinding process.
ductility Excellent horizontal and longitudinal ductility, which can adapt to small deformation during grinding.
  • product details

Product applicationExcellent cushioning performance, no precipitation and excellent appearance flatness. Suitable for wafer and glass thinning tape.

Storage specificationThe general storage temperature is 5~35℃, the relative humidity is 40%~70%, please avoid direct sunlight, and put them in well-ventilated place.

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