How important is adhesive tape in the semiconductor packaging industry?

Substrate Fixation: The tape is utilized to secure semiconductor chips onto the packaging base or substrate, ensuring they remain in the correct position during the encapsulation process. This is crucial for precise chip alignment, enabling accurate subsequent connections and encapsulation procedures.

Temperature control: The semiconductor packaging process typically involves high-temperature operations, such as soldering and solder ball joining. The tape must be able to withstand high temperatures to protect semiconductor chips and other sensitive components and ensure they are not damaged.

Precision Alignment: The tape facilitates the exact positioning of semiconductor chips, cables, and other encapsulation components. It offers dependable support to ensure the secure attachment of elements to the encapsulation base.

ESD Protection: Semiconductor components are highly susceptible to Electro-Static discharge (ESD). The tape can be endowed with anti-static properties, aiding in the reduction or prevention of ESD incidents that could harm the components.

Heat conduction: In some packaging applications, tape can be used as a heat conduction medium, which helps with heat dissipation and temperature management.This is crucial for preventing semiconductor components from overheating.

Temporary protection: During the packaging process, tape can be used to temporarily protect sensitive areas from chemicals, contamination or mechanical damage.

Custom Design: Tape can be tailored to meet the specific requirements of the packaging process, ensuring it fulfills the needs of the packaging technology.