Welcome to Aimi New Materials !
| Low cutting loss | The high ductility and excellent film spreading performance of the base film can buffer the cutting stress and reduce the risk of wafer damage. |
| Anti-static, no precipitation | The anti-static treatment and non-precipitation characteristics of the base film reduce dust adsorption and chemical residue during the cutting process. |
Product application ：Low cutting loss, excellent film spreading performance. Suitable for PKG cutting tape.
Quality assurance：This product is to be used within 6 months from the date of delivery in standard packaging. Please evaluate the product according to your intended use and judge the performance reliability of the product according to your criteria.
Storage specification：The general storage temperature is 5~35℃, the relative humidity is 40%~70%, please avoid direct sunlight, and put them in well-ventilated place.
