Welcome to Aimi New Materials !
| High temperature stabilization | Dimensional stability at high temperatures, support high multi-layer plate precision alignment. |
| High tensile strength | High vertical and horizontal tensile strength ensures that the base film does not break during the pressing process. |
| Flexibility and ductility | The elongation at break can reach 200%~400%, which can adapt to the stress change when the multi-layer plate is pressed. |
| Chemical compatibility | No swelling or dissolution of adhesives such as epoxy resin and polyimide (PI), acid and alkaline resistance. |
Product application：Excellent temperature resistance and filling performance. Suitable for High Density Interconnect (HDI) and soft&hard bonding plate pressure transfer substrate.
Quality assurance ：This product is to be used within 6 months from the date of delivery in standard packaging. Please evaluate the product according to your intended use and judge the performance reliability of the product according to your criteria.
Storage specification ：The general storage temperature is 5~35℃, the relative humidity is 40%~70%, please avoid direct sunlight, and put them in well-ventilated place.
